Q: Hi Tim, any suggestion for sealing material? This means that as you increase the bond line thickness, LM will degrade in performance much less than a grease would. Q: Tim can you talk to the bond layer thickness versus a traditional grease, and where LM is advantageous?Ī: LM has a much higher bulk thermal conductivity than any thermal grease. However, there has been a renewed interest over the past couple of years due to the required heat dissipation of higher power semiconductor devices. There are a number of niche applications. Automotive application?Ī: There isn’t a lot of high volume use of liquid metal-based TIMs today. Q: Can you give some application example which is already using this material for TIM. Alternatively, it may be possible to move away from aluminum entirely although that can be a significant design change. There are engineered solutions around this such as adding a metalized layer of something like Ni to the aluminum where it can contact the TIM. Q: The CPU case is normally Aluminium – so the liquid metal suits are FPGAs only and similar chips?Ī: Gallium based alloys are definitely not a drop-in replacement when coming in direct contact with aluminum. This is an added process step but does add a layer of protection. Q: Is there a way to keep this pumping action contained? Like some kind of seal around the sides?Ī: It is definitely possible to create a seal using an epoxy or silicone ring. This is not something that we have specifically studied but at least seems like a promising approach. Q: Can Ga based liquid metals be applied to anodized aluminum heat sinks?Ī: There are published papers that indicate that anodization can prevent the gallium dissolution. As the immersion liquid comes into contact with the liquid metal, I can see the possibility of displacement that potentially pushes some of the liquid metal out from under the interface. Q: Is the liquid metal TIM compatible with immersion cooling technique?Ī: To my knowledge, this has not been studied but it seems like it would be risky. This all depends on the metals being used and the exposure temperature. Likewise, it is possible for the liquid metal to dissolve metal from surfaces it is in contact with. For example, if there are solid particles that are soluble in Ga, they will dissolve into the liquid over time. Q: Does the physical structure of these hybrids change over time during thermal cycling or power cycling?Ī: Depending on the composition of these hybrid TIMs, it is possible for their structure to change over time. At some point, if you massively over apply the liquid metal to the interface, it will be possible to have the liquid flow. This is similar to water between glass microscope slides. The adhesive forces of the metals to the other surfaces prevent it from flowing out of the interface. Q: Can these liquids or solid-liquid hybrids be mounted in a vertical position?Ī: As long as you are working with a relatively thin bond line, these materials can be oriented vertically. You may also select materials based on solubility, corrosion resistance, and tendency to oxidize. Ideally, you want something higher in thermal conductivity to improve the overall performance of the system. First is the thermal conductivity of that material. Q: How do you decide which materials to mix with the liquid metals to make a hybrid solution?Ī: There are several factors that go into determining what materials should be mixed with the liquid metals. If your still getting the same heat output, you heatsink, or fans might be bad.Below are the questions asked during the event, along with their respective answers. Close the laptops case together, do what you want but I would test if it turned on and then screw it all together.I would give the inside of your device a dusting with canned air.Use a toothpick or a clean and lint-free cloth to spread the liquid metal in a thin and even layer and check that the liquid metal covers the entire surface of the CPU To apply, squeeze a small amount of liquid metal onto the center of the CPU.I saw something about applying thermal pads but I have no clue why you need to do that.Clean, and empty your workspace to avoid debris and dust getting in your system.You need a few tools and supplies, including liquid metal thermal compound, isopropyl alcohol, thermal pads, thermal paste removal tool.I have not done this, but I have repasted multiple devices around the house, I could not find a teardown guide for your laptop but here or some good noted for Liquid Metal repastes that I have found on the internet:
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